ABSTRACT The problem of providing high-quality soldered joints during the assembly and installation of electronic products draws attention to the use of effective methods for controlling the solderability of electronic components and functional coatings of parts. The solderability of electroplated coatings used in electronics was studied by two methods: evaluating the spreading of a dosed drop of solder and the wetting force by molten solder. The criteria for evaluating the solderability of coatings are systematized and refined.
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